U.S. Patents Awarded to Inventors in Maine (May 5)
(Targeted News Service Via Acquire Media NewsEdge) Targeted News Service
Targeted News Service
ALEXANDRIA, Va., May 5 -- The following federal patents were awarded to inventors in Maine.
Fairchild Semiconductor Assigned Patent
ALEXANDRIA, Va., May 5 -- Fairchild Semiconductor, South Portland, Maine, has been assigned a patent (8,168,473) developed by Yong Liu, Scarborough, Maine, for a "molded ultra thin semiconductor die packages, systems using the same, and methods of making the same."
The abstract of the patent published by the U.S. Patent and Trademark Office states: "Disclosed are molded ultra-thin semiconductor die packages, systems that incorporate such packages, and methods of making such packages. An exemplary package comprises a leadframe having an aperture formed between the leadframe's first and second surfaces, and a plurality of leads disposed adjacent to the aperture. The package further comprises a semiconductor disposed in the aperture of the leadframe with its top surface substantially flush with the leadframe's first surface, and at least one gap between at least one side surface of the semiconductor die and at least one lead of the leadframe. A body of electrically insulating material is disposed in the at least one gap. A plurality of conductive members interconnect leads of the leadframe with conductive regions on the die's top surface, with at least one conductive member having a portion disposed over at least a portion of the body of insulating material."
The patent application was filed on Nov. 5, 2010 (12/940,319). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=8168473.PN.&OS=PN/8168473&RS=PN/8168473
Written by Kusum Sangma; edited by Anand Kumar.
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